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Company
Qualcomm Israel Ltd.
Job Area
Engineering Group, Engineering Group > ASICS Engineering
General Summary
Staff Hardware Design Engineer – Application Engineering
We are seeking a highly motivated Staff Hardware Design Engineer to join our Application Engineering team supporting next-generation Optical DSP, Active Electrical Cable (AEC), and Optical Transceiver solutions for AI and cloud infrastructure.
In this role, you will be responsible for the design, development, bring-up, validation, and support of evaluation platforms used for customer engagements, product characterization, and application development. You will work closely with Application Engineering and Hardware Engineering to accelerate product adoption and enable customer success.
The ideal candidate combines strong board-level hardware design expertise with hands-on laboratory debugging experience and a deep understanding of high-speed signal integrity and power integrity challenges in 100G/lane, 200G/lane, and future 400G/lane PAM4 systems.
What you'll do
Evaluation Board Development
Independently own EVB development projects from specification through validation.
Lead hardware bring-up and debugging efforts for application engineering platforms.
Act as the hardware expert supporting both internal engineering teams and external customers.
Drive signal integrity and power integrity analysis to support successful product deployment.
Serve as the primary hardware liaison for application engineering activities..
EVB Bring-Up, Validation & Debug
Lead first-power-on and bring-up activities for newly developed hardware platforms.
Perform board-level debug involving:
Perform root-cause analysis and drive corrective actions for hardware issues.
Support system characterization and reliability testing activities.
Customer Optical Transceiver Support
Support customers integrating DSP products into optical transceivers and AEC platforms.
Review customer schematic designs and PCB layouts.
Assist customers in resolving hardware-related issues during design and deployment phases.
Work directly with customer hardware teams during bring-up and qualification activities.
Power Integrity & Power Delivery Design
Analyze power delivery networks for high-performance DSP and optical products.
Perform power integrity simulations and validation using industry-standard tools.
Evaluate:
Voltage ripple
Transient response
Decoupling effectiveness
Power distribution performance
Optimize power delivery architectures to meet performance and reliability requirements.
Requirements
BS or MS in Electrical Engineering or related field.
5 to 8 years of experience in high-speed hardware development, PCB design for high-speed SerDes or optical transceiver design
Strong experience in schematic capture, PCB design review, and hardware development processes.
Familiar with high-speed PAM4 signaling and SerDes-based systems.
Hands-on experience with EVB design, bring-up, validation, and debug.
Strong knowledge of signal integrity, fundamentals and channel analysis.
Deep Knowledge of power integrity concepts and power delivery network design.
Experience with laboratory equipment for EVB bring up:
Strong troubleshooting and root-cause analysis skills.
Excellent communication and documentation skills.
Bachelor's degree in Science, Engineering, or related field and 6+ years of ASIC design, verification, validation, integration, or related work experience.
OR
Master's degree in Science, Engineering, or related field and 5+ years of ASIC design, verification, validation, integration, or related work experience.
OR
PhD in Science, Engineering, or related field and 4+ years of ASIC design, verification, validation, integration, or related work experience.
References to a particular number of years experience are for indicative purposes only. Applications from candidates with equivalent experience will be considered, provided that the candidate can demonstrate an ability to fulfill the principal duties of the role and possesses the required competencies.
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Nice to have
Experience with Signal Integrity simulation tools such as HFSS
Experience with optical transceiver design
Experience with thermal analysis and mechanical integration considerations.
Knowledge of PCB stack-up design and high-speed materials.
Experience with manufacturing qualifications and production support.