Description
Electronic packaging and electromechanical solutions for MIL hardened sub-systems.
Designing complex assemblies while keeping them easy to assemble and simple to repair.
Thermal design.
Interface with electronic engineers and PCB designers.
Responsibility for the entire mechanical manufacturing process – from design to serial production.
Design of test equipment and complementary components.
Support of production engineering department.
Requirements
Leading academic institute graduate – mandatory.
6 to 8 years experience in electronic packaging – mandatory.
Knowledge and deep understanding of mechanical manufacturing processes such as CNC, milling, routing, turning, flange forming etc. – mandatory.
Expert user of CAD programs such Solid Edge.
Knowledge of and experience with military and aviation standards such as MIL-STD-810 and RTCA/DO-160
Background in power supply design – advantage
Background in thermal and strength analysis – advantage.
Experience in mechanical design of PCBs and electromechanical hardware selection – advantage.
Self-teaching ability. Ability to quickly learn and understand concepts.
High motivation.
Work in a team and individually.