IC Package Layout Engineer

Mobileye develops purpose-built hardware and AI technologies that power advanced driver-assistance and autonomous-driving solutions. Our EyeQ™ SoCs and imaging radar technologies are designed to deliver scalable, automotive-grade performance and help enable safer mobility worldwide. Join our advanced packaging team and take ownership of package-substrate layout for cutting-edge digital and RF products. You will collaborate with silicon, package, SI/PI, PCB, manufacturing, and OSAT teams to deliver high-quality, manufacturable package layouts that meet demanding automotive requirements What will your job look like: Own IC package-substrate layout from feasibility through manufacturing release. Perform die placement, bump fan-out, ball-map planning, package-size estimation, and layer planning. Set up stack-ups, padstacks, design rules, and layout constraints. Implement high-density bump-to-ball routing for signal, power, and ground nets. Route high-speed and RF interfaces according to defined SI/PI constraints. Perform DRC, connectivity, LVS/netlist, and DFM checks. Generate artwork, fabrication drawings, reports, and release documentation. Resolve layout-related queries from substrate manufacturers and OSATs. All you need is: B.Sc. in Electrical Engineering or a related field, or equivalent practical experience. 5+ years of hands-on IC package-substrate layout experience. Strong proficiency with Cadence Allegro Package Designer. Experience with flip-chip BGA, bump fan-out, ball-map optimization, and multilayer substrate routing. Experience working from schematics, netlists, design rules, and constraint documents. Good understanding of high-speed layout principles, including differential pairs, length matching, spacing, and return paths. Good understanding of power-delivery and power-integrity layout principles, including power and ground plane design, current-carrying requirements, and via-array implementation. Experience with DRC, connectivity verification, DFM, and manufacturing-data release. Strong attention to detail and the ability to independently own designs through release.