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NPI & System Product Engineer at Drivenets · Trevo
About DriveNets
DriveNets is a leader in high-scale networking software for AI infrastructure and service providers. The company pioneered a disaggregated networking architecture that transforms the economics of large-scale networks while maximizing performance, utilization, and operational efficiency. DriveNets-powered networks are deployed by global leaders, including AT&T and Comcast, supporting more than 30% of total U.S. internet traffic. DriveNets AI Fabric delivers full-stack networking for AI infrastructures, providing the highest-performance, Ethernet-based alternative to InfiniBand. The solution is deployed by hyperscalers, NeoClouds, and enterprises worldwide. With over $1B raised, DriveNets continues to push the boundaries of modern networking infrastructure.
We are looking for an NPI & System Product Engineer to drive the transition of advanced networking switches and data center infrastructure systems from late-stage R&D validation & NPI into scalable mass production.
In this role, you will lead the handoff from DVT completion into PVT entry, support the setup and deployment of new production lines at global Contract Manufacturers, and execute capacity ramp-up plans toward High-Volume Manufacturing. You will serve as the technical operational link between R&D design/NPI teams and factory lines, ensuring line balancing, fixture readiness, yield optimization, and hands-on root-cause failure analysis (RCA).
What you'll do
Production Readiness:
Support the technical handoff from R&D DVT exit to Operations PVT readiness.
Track and verify closure of open DVT hardware issues, check BOM readiness, and validate manufacturing gating criteria before mass production.
Execute PVT build plans to ensure product design tolerances align with factory process capabilities.
New Production Line Setup & Deployment:
Participate in the setup, line balancing, and deployment of new manufacturing lines and assembly workcells for chassis and full-rack integrated systems at CM facilities.
Validate physical workstation setups, line assembly flows, operator guidelines, and improve processes.
Verify assembly fixtures, press-fit tooling, and automated test stations during new line deployment.
Create and maintain production test procedures.
Capacity Ramp-Up & Takt Time Optimization:
Monitor station takt times, identify line bottlenecks, and drive cycle-time reduction initiatives.
Support the duplication and operational verification of line fixtures, tooling, and test stations to meet capacity scaling targets.
Track production ramp-up from pilot runs through full-rate High-Volume Manufacturing.
System Product Engineering & Yield Optimization:
Monitor key manufacturing metrics across PCBA & box-build assembly lines: First Pass Yield (FPY), Line Fallout, and Scrap Rate.
Use Statistical Process Control (SPC) and factory telemetry logs to identify systemic yield detractors.
Assist in refining production test limits, calibration procedures, and screening guardbands during volume ramp.
Root Cause Analysis (RCA) & Debugging:
Perform hands-on failure triage on system-level dropouts, intermittent hardware faults, and line fallouts during PVT and ramp-up.
Use schematics, Cadence Allegro board layouts, scopes, JTAG, and diagnostic tools to isolate component vs. process defects.
Requirements
B.Sc. in Electrical Engineering, Computer Engineering, or equivalent technical degree.
3–5 years of hands-on NPI / System Product Engineering experience specifically in high-performance telecommunications, data center networking switches/routers, enterprise servers, optical hardware.
Hands-on experience participating in DVT-to-PVT transitions, new production line setup, and factory volume ramp-ups at CM facilities.
Solid understanding of electronics production processes (Press-fit, boundary scan, functional tests, thermal stress chambers, box-build, and rack integration).
Good understanding of complex digital architectures: high-throughput network switch ASICs, high-speed SerDes, power delivery subsystems, and optical transceivers.
Demonstrated ability to isolate intermittent hardware, component, and assembly defects using structured RCA/8D approaches.
Fluent English (written and verbal); willingness and ability to travel to overseas manufacturing sites for new line deployments, PVT builds, and factory reviews.
Nice to have
Liquid Cooling Manufacturing Experience (Significant Advantage): Practical experience with liquid-cooled hardware in a production environment, including cold-plate assembly, manifold routing, quick-disconnect handling, liquid system processes on production lines.
Proficiency in data analytics and scripting tools for automated log analysis and yield tracking.
Working knowledge of enterprise PLM systems (Agile, Arena) and schematic/layout viewers (Allegro / OrCAD).