Ceragon is the global innovator and leading solutions provider of end-to-end wireless connectivity, specializing in transport, access, and AI-powered managed & professional services. Through our commitment to excellence, we empower customers to elevate operational efficiency and enrich the quality of experience for their end users.
Our customers include service providers, utilities, public safety organizations, government agencies, energy companies, and more, who rely on our wireless expertise and cutting-edge solutions for 5G & 4G broadband wireless connectivity, mission-critical services, and an array of applications that harness our ultra-high reliability and speed.
Ceragon solutions are deployed by more than 600 service providers and over 1,600 private network owners across more than 130 countries.
Through our innovative end-to-end portfolio spanning hardware, software, managed services, and professional services, Ceragon enables customers to embrace the future of wireless technology with confidence while delivering reliable, high-capacity, and cost-effective connectivity solutions worldwide.
Experience in design for manufacturing (DFM) including plastic injection molding, metal casting, machining, stamping, and forming
Experience in electronic packaging design
Experience in Electro Mechanical Integration
Experience in leading full life cycle projects
Experience with PLM systems, engineering changes, BOM structuring, etc.
Experience in design of indoor and outdoor equipment
Experience in thermal, dynamical and statical design and analysis
Experience in design of telecommunication/RF equipment – an advantage
Experience in mentoring engineers – an advantage
Perform analysis, testing, design iterations, and validation of the designs
Requirements
At least 5 years of experience in electronics packaging design