Image Sensor Firmware Engineer Integrator

Description Samsung Israel R&D Center (SIRC), is shaping the world of tomorrow, today. Focusing beyond the horizon and pushing exciting developments in many key areas of technology. Samsung is creating a new era of continuous innovation, bringing value and contribution to society and creating a workplace where our employees can enjoy making the most of their talent, creativity and passion. We are looking for people with a broad set of technical skills, who are ready to tackle some of technology’s greatest challenges, and who can think out of the box and bring the disruptive technologies that will define our future. The Group: Our group develops image sensors that are integrated into the cameras of all leading smartphone brands. Team members are expected to gain a deep understanding of all systems layers from block and IP level through chip and system up to user interfaces. What will you do? Adapt firmware to new silicon - Update existing C code to match the latest register definitions and newly added HW IP blocks (image‑processing pipelines, accelerators, etc.). Pre‑silicon bring‑up - Get the firmware running on freshly delivered RTL releases using HW Emulators such as Palladium and FPGA platforms. Troubleshoot integration issues – Identify and fix timing, clock‑domain, and HW‑SW emulation problems. Verify full functional correctness of the integrated system. Diagnose and correct any issues that arise from RTL changes and their ripple effect on the FW. Tightly collaborate with engineers from teams such as Algorithms, Analog, Digital Design, Digital Verification, FW Verification and FAEs. Develop end‑to‑end system firmware – Implement and maintain the code that controls the entire chip and data-path, including secure boot, image‑processing block control, HW‑IP configuration, external‑IC communication, smartphone Application Processor interface, memory management, and related functions. Influence system architecture, emulation environment. Define new emulation capabilities and Develop tools to improve and speed up the bring-up process. Requirements Requirements: At least 4 years of experience in real-time embedded systems firmware development. Ability to understand the full system requirements, constraints and limitations. Hands‑on experience with pre‑silicon bring‑up on both hardware emulators (Palladium or equivalent) and FPGA prototype platforms. Ability to debug complex HW-SW issues, on HW (RTL) that is not fully verified. Excellent teamwork skills, flexibility, and ability to handle multiple tasks. Ability to debug issues efficiently and quickly while rallying the appropriate engineers to address them B.Sc. or M.Sc. in Electrical Engineering or equivalent experience. Capability to quickly grasp new fields and technologies. Advantages: Experience in developing and debugging integrated hardware-software systems during the hardware development stage. Experience in firmware development on hardware emulators such as FPGA and Cadence Palladium. Ability to efficiently and rapidly troubleshoot issues, coordinating the appropriate engineers, and to perform waveform-based debugging using Interactive waveform viewer tools such as SimVision / Verdi / Questa Sim. Experience in FPGA Prototyping. Extensive C programming experience. Ability to use AI agents for automation of development process. Proficient in Python. Experience with Arm Cortex-based CPUs, RISC-V ISA CPUs.