Advanced Package Technology, Principal Engineer ב-Marvell · Trevo

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About Marvell Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities. At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead. Your Team, Your Impact The Marvell Advanced Packaging R&D team is responsible for package design and technology development to meet the electrical, mechanical, thermal and system requirements for the next generation high performance computing (HPC), Artificial Intelligence (AI) and networking solutions. The group focuses on signal integrity, power integrity, thermal integrity, mechanical integrity, processability, manufacturability, and reliability, involving high speed signaling and complex power delivery networks (PDNs) requiring innovative and custom solutions to meet constantly evolving customer needs. Many of the new designs require multi-chip, multiple component configurations involving, but not limited to, 2.5D and 3D packages, Co-packaged copper or optics and advanced substrates. Marvell has partnered with the world's leading manufacturers to solve our customer’s most challenging designs and integrations with industry-leading packaging technologies. What You Can Expect Develop packaging technology roadmap for AI XPU, XPU-attach and Switch Explore technologies beyond what is currently available, make recommendations, and create and protect IP to maximize performance. Create new package technology concepts from open ended ideas, perform routing feasibility, signal and power integrity studies for design optimization. Explore technology feasibility and create proof-of-concept samples and productize technologies. Define package architecture including chiplet topology, interposer/substrate scaling, power delivery network strategy, and thermal design envelope. Lead co-design efforts across silicon design, floorplanning, PDN modeling, and mechanical/thermal reliability. Lead package material selection, substrate stack-up definition, mechanical modeling, and reliability analysis. Partner with silicon design teams to co-optimize die floorplan, bump map, TSV, and RDL requirements. Work with OSATs / Foundry partners to evaluate process capability, manufacturability, yield, and cost. Drive package qualification and reliability validation to volume readiness.

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Ability to develop an idea into a proof of concept and then a proof of concept into a productizable technology
Deep understanding of fundamental concepts of signal and power integrity, transmission line and electromigration, and the ability to apply those concepts to create new design rules and explore new technologies utilizing current baseline for 2.5D/3D package technology including (a) CoWoS-S/R/L, (b) EMIB-T, (c) CPO, (d) CPC.
Mastery in tools and workflows to guide and enable the team on what sims need to be run: previous hands-on experience with signal and power integrity analyses using Cadence Sigrity PowerSI and Ansys SIwave; EM sims using Ansys HFSS, SI-Wave, Cadence Clarity, and the ability to correlate that with real world challenges is a required skill.
Good understanding of interposer, substrate, package, PCB level design rules, ability to perform routing feasibility studies using Cadence APD or PCB editor. Good understanding of chip-package interactions and failure mechanism at component and board level, thermal and warpage management.
Ability to manage programs involving cross-functional teams. Strong interpersonal skills and willingness to learn new things are necessary along with the ability to work with stakeholders in multiple time zones across the globe. Ability to influence vendors to align their roadmap with company goals. Strong communication, presentation and documentation skills
The ideal candidate would have:
Prior experience in data center AI accelerators, networking silicon, or custom HPC silicon. Board, system and rack level integration, thermal, mechanical, signal and power analysis.
Ability to influence senior stakeholders across architecture, silicon design, system platform engineering, and supply chain
Experience setting roadmaps, not just executing them.
Experience with silicon disaggregation and reaggregation and memory integration.
Demonstrated leadership driving cross-company supplier programs.
Experience with VNA and TDR measurements for package and PCB characterization
Experience in advanced package and substrate technologies with understanding of process and materials, component and board level reliability, warpage and thermal management.
This role is eligible to participate in Marvell's bonus and equity plans, including a new hire equity grant and annual equity refreshers, ensuring you are rewarded for your contributions and remain invested in the company's long-term success.
Additional Compensation and Benefit Elements
With competitive compensation and great benefits, you will enjoy our workstyle within an environment of shared collaboration, transparency, and inclusivity. We’re dedicated to giving our people the tools and resources they need to succeed in doing work that matters, and to grow and develop with us. For additional information on what it’s like to work at Marvell, visit our Careers page.
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status.
Interview Integrity
To support fair and authentic hiring practices, candidates are not permitted to use AI tools (such as transcription apps, real-time answer generators like ChatGPT or Copilot, or automated note-taking bots) during interviews.
These tools must not be used to record, assist with, or enhance responses in any way. Our interviews are designed to evaluate your individual experience, thought process, and communication skills in real time. Use of AI tools without prior instruction from the interviewer will result in disqualification from the hiring process.
This position may require access to technology and/or software subject to U.S. export control laws and regulations, including the Export Administration Regulations (EAR). As such, applicants must be eligible to access export-controlled information as defined under applicable law. Marvell may be required to obtain export licensing approval from the U.S. Department of Commerce and/or the U.S. Department of State. Except for U.S. citizens, lawful permanent residents, or protected individuals as defined by 8 U.S.C. 1324b(a)(3), all applicants may be subject to an export license review process prior to employment.
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Advanced Package Technology, Principal Engineer

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